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    H1170Z
    
				
			
    
			
    
				
    FEATURES
    Very lower Z-CTE
    Low water absorption
    Excellent thermal reliability
    Anti-CAF Capability

    APPLICATIONS
    Automotive,like ECU,BMS,MCU,VCU 
    Power suppliers
    Back panel,Network and other Multilayer PCB
    Industrial

    GENERAL PROPERTIES
    Item
      IPC-TM-650
    Test Condition
    Unit
    Typical value
    Glass transition temp.
    2.4.25
    DSC
    ℃
    185
    CTE,Z-axis
    2.4.24
    α1，TMA
    ppm/℃
    35
    α2，TMA
    ppm/℃
    184
    50~260℃，TMA
    %
    2
    Decomposition Temp.
    2.4.24.6
    TGA
    ℃
    360
    T288
    2.4.24.1
    TMA,copper clad
    min
    30
    Thermal stress
    2.4.13.1
    Copper clad
    sec
    >120
    unclad
    sec
    >180
    Water absorption
    2.6.2.1
    E-1/105+D-24/23
    %
    0.1
    Peel Strength/18μm
    2.4.8
    as received
    lb/in
    6.5
    after thermal stress
    lb/in
    6.5
    Permittivity(RC50%)
    2.5.5.9
    C-24/23/50,1G
    /
    4.4
    Loss tagent(RC50%)
    2.5.5.9
    C-24/23/50,1G
    /
    0.016
    Volume resistivity
    2.5.17.1
    C-96/35/90
    MΩ·cm
    3.20*108
    Surface resistivity
    2.5.17.1
    C-96/35/90
    MΩ
    9.80*107
    Arc Resistance
    2.5.1
    D48/50+D0.5/23
    sec
    122
    Dielectric Breakdown
    2.5.6
    D48/50+D0.5/23
    kV
    58
    Flexural strength
    Warp
    2.4.4
    as received
    MPa
    565
    Fill
    2.4.4
    as received
    MPa
    455
    Flame resistance
    UL-94
    A&E-24/125
    /
    V0
    CTI
    C-96/20/65
    IEC-60112
    Rating
    PLC3
     
    u  Specification sheet:IPC-4101/126/101/99/98, for reference only.
    u  Above typical value is tasted from CCL1.0mm 7628*5,except Dk/Df,the typical value is only for reference，cannot be used as the basis for judgement.